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Thermo-mechanical analysis of flip chip on substrate bumps - assemblies
Publication:
Thermo-mechanical analysis of flip chip on substrate bumps - assemblies
Date
1997
Proceedings Paper
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2243.pdf
1004.3 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Christiaens, Filip
;
Beyne, Eric
;
Roggen, Jean
;
Peeters, J.
;
Allaert, K.
Journal
Abstract
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1899
since deposited on 2021-09-30
Acq. date: 2025-10-24
Citations
Metrics
Views
1899
since deposited on 2021-09-30
Acq. date: 2025-10-24
Citations