Browsing by Author "Perello, Carles"
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Publication A high performance 0.18µm elevated source/drain technology with improved manufacturability
Proceedings paper1999, ESSDERC'99 - Proceedings of the 29th European Solid-State Device Research Conference, 13/09/1999, p.636-639Publication A high performance of 0.18μm CMOS technology designed for manufacturability
Proceedings paper1997, ESSDERC '97: Proceedings of the 27th European Solid-State Device Research Conference, 22/09/1997, p.404-407Publication A new dummy-free shallow trench isolation concept for mixed-signal applications
;Badenes, Gonçal ;Rooyackers, Rita ;Augendre, Emmanuel ;Vandamme, EwoutPerello, CarlesProceedings paper1999, ULSI Process Integration. Proceedings of the First International Symposium, 17/10/1999, p.231-241Publication A new dummy-free shallow trench isolation concept for mixed-signal applications
;Badenes, Gonçal ;Rooyackers, Rita ;Augendre, Emmanuel ;Vandamme, EwoutPerello, CarlesJournal article2000, Journal of the Electrochemical Society, (147) 10, p.3287-3282Publication Elevated source/drain by sacrificial selective epitaxy for high performance deep submicron CMOS: process window versus complexity
Journal article2000, IEEE Trans. Electron Devices, (47) 7, p.1484-1491Publication L-shape spacer architecture for low cost, high performance CMOS
;Augendre, Emmanuel ;Perello, Carles ;Vandamme, Ewout ;Pochet, SandrineRooyackers, RitaProceedings paper2001, ULSI Process Integration II; 26 March 2001; Washington, D.C., USA., p.297-304Publication Optimisation of critical parameters in a low cost, high performance deep submicron CMOS technology
;Badenes, Gonçal ;Perello, Carles ;Rupp, Andreas ;Vandamme, EwoutAugendre, EmmanuelProceedings paper1999, ESSDERC'99 - Proceedings of the 29th European Solid-State Device Research Conference, 13/09/1999, p.628-631Publication Test structures for MCM-D technology characterization
;Lozano, M. ;Santander, J. ;Cabruja, E. ;Perello, Carles ;Ullan, M. ;Lora-Tamayo, E.Doyle, R.Journal article1999, IEEE Trans. Semiconductor Manufacturing, (12) 2, p.184-192