Browsing by Author "Pinel, S."
Now showing 1 - 6 of 6
- Results Per Page
- Sort Options
Publication Residual thermo-mechanical stresses in thinned-chip assemblies
Proceedings paper1999, Proceedings of 5th International Workshop on Thermal Investigations of ICs and Microstructures - THERMINIC, 3/10/1999, p.306-311Publication Residual thermomechanical stresses in thinned-chip assemblies
Journal article2000, IEEE Trans. Components and Packaging Technologies, (23) 4, p.673-679Publication Thermal management in a new ultra-thin chip stack technology
; Proceedings paper2001, Proceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France., p.269-276Publication Thermal modeling and management in ultrathin chip stack technology
; ; Publication Ultra thin chip vertical integration technique
; ; Marco, S.Proceedings paper2001, Conference Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Stras, p.299-302Publication Ultra thin electronics for space applications
; ;