Browsing by Author "Podprocky, Tomas"
Now showing 1 - 10 of 10
- Results Per Page
- Sort Options
Publication A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources
;Mandamparambil, Rajesh ;Fledderus, Henri ;van den Brand, Jeroen ;Saalmink, MilanKusters, RoelProceedings paper2009, Proc. of the 8th annual Flexible Electronics & Display Conference, 3/02/2009Publication Integration of thick film resistors in a multilayer structure
Proceedings paper2003, 26th International Spring Seminar on Electronics Technology. Integrated Management of Electronic Materials Production. ISSE, 8/05/2003, p.137-140Publication Low temperature flip chip attachment for flexible display applications
Proceedings paper2004, International Conference on Electronics Packaging - ICEP, 14/04/2004, p.307-312Publication Low temperature flip chip with adhesives on PES
Proceedings paper2003, 14th European Microelectronics and Packaging Conference & Exhibition, 23/06/2003, p.319-324Publication Micromirror with electromechanical pulse width modulation
Proceedings paper2009, Proceedings of the 29th International Display Research Conference (Eurodisplay 2009), 14/09/2009, p.428-431Publication Novel interconnection processes for low cost PEN/PET substrates
;van den Brand, Jeroen ;Kusters, Roel ;Fledderus, Henri ;Rubingh, Eric-JanPodprocky, TomasProceedings paper2009, 17th European Microelectronics and Packaging Conference & Exhibition - EMPC, 15/06/2009Publication Novel micromirror design with variable pull-in voltage
Oral presentation2009, 35th International Conference on Micro & Nano Engineering (MNE)Publication Novel micromirror design with variable pull-in voltage
Journal article2010, Microelectronic Engineering, (87) 5_8, p.1248-1252Publication SiGe micromirrors for optical applications
Proceedings paper2010, Photonics North 2010, 1/06/2010, p.77501SPublication Thick film inductors for RF applications
Proceedings paper2003, 14th European Microelectronics and Packaging Conference & Exhibition, 23/06/2003, p.138-142