Browsing by Author "Privett, Mark"
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Publication Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications
Proceedings paper2013, IEEE 63rd Electronic Components and Technology Conference - ECTC, 28/05/2013, p.113-117Publication Temporary bonding for high-topography applications: spin-on material versus dry film
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.894-898Publication Thick adhesive temporary bonding for high topography applications: spin-on versus dry bonding film processes
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.894-898