Browsing by Author "Priyabadini, Swarnakamal"
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Publication 3D stacking of ultra-thin chip packages: an innovative packaging and interconnection technology
Journal article2013-07, IEEE Transactions on Components and Packaging Technologies, 3, p.1144-1122Publication 3D-stacking of ultra-thin chips and chip packages
Priyabadini, SwarnakamalPHD thesis2013-11Publication 3D-stacking of UTCPs as a module miniaturisation
Proceedings paper2011, 44th International Symposium on Microelectronics - IMAPS, 9/10/2011, p.463-468Publication 3D-stacking of UTCPs as a module miniaturisation technology
Priyabadini, SwarnakamalOral presentation2011, 44th International Symposium on Microelectronics - IMAPSPublication An approach to produce a stack of photo definable polyimide based flat UTCPs
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
Proceedings paper2012, 45th International Symposium on Microelectronics, 9/09/2012, p.940Publication High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages
Journal article2014, IEEE Transactions on Components, Packaging and Manufacturing Technology, (4) 1, p.158-167Publication Photo-definable polyimide-based flat UTCP technology for 3D-stacking application
Proceedings paper2013, Smart Systems Integration, 13/03/2013