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3D-stacking of ultra-thin chips and chip packages
Publication:
3D-stacking of ultra-thin chips and chip packages
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Date
2013-11
Dissertation
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28677.pdf
13.94 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Priyabadini, Swarnakamal
Journal
Abstract
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2113
since deposited on 2021-10-21
Acq. date: 2025-12-12
Citations
Metrics
Views
2113
since deposited on 2021-10-21
Acq. date: 2025-12-12
Citations