Publication:
3D-stacking of ultra-thin chips and chip packages
Date
| dc.contributor.author | Priyabadini, Swarnakamal | |
| dc.contributor.thesisadvisor | Vanfleteren, Jan | |
| dc.contributor.thesisadvisor | Sterken, Tom | |
| dc.date.accessioned | 2021-10-21T11:06:00Z | |
| dc.date.available | 2021-10-21T11:06:00Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2013-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/22955 | |
| dc.title | 3D-stacking of ultra-thin chips and chip packages | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |