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    Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

    Beyne, Sofie  
    ;
    Croes, Kristof  
    ;
    van der Veen, Marleen  
    ;
    Varela Pedreira, Olalla  
    ;
    Qi, Q.
    Proceedings paper
    2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3

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