Publication:

Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

Date

2017

Proceedings Paper

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Files

35528.pdf 312.55 KB

Author(s)

;

;

van der Veen, Marleen

;

Varela Pedreira, Olalla

;

;

De Wolf, Ingrid

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Statistics

1974 since deposited on 2021-10-24

Acq. date: 2026-02-24