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Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
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Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
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Date
2017
Proceedings Paper
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35528.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Sofie
;
Croes, Kristof
;
van der Veen, Marleen
;
Varela Pedreira, Olalla
;
Qi, Q.
;
De Wolf, Ingrid
;
Tokei, Zsolt
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1972
since deposited on 2021-10-24
Acq. date: 2025-12-15
Citations
Metrics
Views
1972
since deposited on 2021-10-24
Acq. date: 2025-12-15
Citations