Publication:
Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
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1974 since deposited on 2021-10-24
2last month
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Acq. date: 2026-01-08
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1974 since deposited on 2021-10-24
2last month
1last week
Acq. date: 2026-01-08
Citations