Publication:
Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
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1977 since deposited on 2021-10-24
3last month
Acq. date: 2026-04-06
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Statistics
Views
1977 since deposited on 2021-10-24
3last month
Acq. date: 2026-04-06
Citations