Publication:

Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

Date

2017
Proceedings Paper
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dc.contributor.authorBeyne, Sofie
dc.contributor.authorCroes, Kristof
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorQi, Q.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorBeyne, Sofie
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-24T02:59:44Z
dc.date.available2021-10-24T02:59:44Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27850
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7968946/
dc.source.beginpage1
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate16/05/2017
dc.source.conferencelocationHsinchu Taiwan
dc.source.endpage3
dc.title

Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

dc.typeProceedings paper
dspace.entity.typePublication
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