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Browsing by Author "Reichardt, Maik"

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    Publication

    3D-SoC integration utilizing high accuracy wafer level bonding

    Peng, Lan  
    ;
    Kim, Soon-Wook  
    ;
    Heylen, Nancy  
    ;
    Reichardt, Maik
    ;
    Kurz, Florian
    ;
    Wagenleitner, Thomas
    Proceedings paper
    2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.111-114

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