Browsing by Author "Rennau, M."
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Publication Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance
;Fruhauf, S. ;Himcinschi, C. ;Rennau, M. ;Schulze, K. ;Schulz, S.E. ;Friedrich, M.Gessner, T.Journal article2005, Microelectronic Engineering, (82) 3_4, p.405-410