Browsing by Author "Schleicher, F."
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Publication Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
Journal article2024, IEEE TRANSACTIONS ON ELECTRON DEVICES, (71) 12, p.7963-7969Publication Integration of Through-Dielectric-Via on Buried Power Rail and Slit Nano Through-Silicon-Via for Enhanced Backside Connectivity
Proceedings paper2025, 2025 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC, 2025-06-02