Browsing by Author "Selberherr, S."
Now showing 1 - 3 of 3
- Results Per Page
- Sort Options
Publication Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
Journal article2023, JOURNAL OF APPLIED PHYSICS, (133) 10, p.Art. 105101Publication Investigation of intrinsic stress effects in cantilever structures
;Hollauer, Christian ;Ceric, Hajdn ;Van Barel, Greg ;Witvrouw, AnnSelberherr, S.Proceedings paper2007, Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems - NEMS, 16/01/2007, p.151-154Publication Review-Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects
Journal article review2021, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (10) 3, p.035003