Browsing by Author "Siau, Sam"

Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask

Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments

Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections

Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for usage for usage as build-up layer

Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer

Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for build-up layers. Part 1: sweller influence

Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for build-up layers. Part 2: oxidative treatment of the surface

Optimization and modeling of chemically treated build-up epoxy layers