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Conference contributions
Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper
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Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper
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Date
2004
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Siau, Sam
;
Vervaet, A.
;
Van Calster, Andre
;
Schacht, E.
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Abstract
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1891
since deposited on 2021-10-15
Acq. date: 2025-12-11
Citations
Metrics
Views
1891
since deposited on 2021-10-15
Acq. date: 2025-12-11
Citations