Browsing by Author "Strid, Eric"
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Publication Evaluation of TSV and micro-bump probing for wide I/O testing
Proceedings paper2011-09, IEEE International Test Conference - ITC, 20/09/2011Publication Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
Oral presentation2011, IEEE Semiconductor Wafer Test Workshop - SWTWPublication Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs