Browsing by Author "Strubbe, Katrien"
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Publication Adsorption/desorption of suppressor complex on copper: description of the critical potential
Proceedings paper2011-01, Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 7, 9/10/2010, p.13-26Publication Adsorption/desorption of suppressor complex on copper: description of the critical potential
Meeting abstract2010, 218th ECS Meeting Symposium 'Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition 7', 10/10/2010, p.2039Publication Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Meeting abstract2009, 216th ECS Meeting, 4/10/2009, p.2178Publication Direct copper plating on a RuTa substrate
Meeting abstract2010, 217th ECS Meeting Symposium "Electrochemical Engineering for the 21st Century", 24/04/2010, p.1259Publication Effect of ionic strength and the electrolyte composition on the suppression of copper deposition by PEG
Proceedings paper2010, Fundamentals of Electrochemical Growth: From UPD to Microstructures - Symposium in Memory of Prof. Evgeni Budevski, 4/10/2009, p.67-78Publication Electrochemical determination of the cupric ion activity in aqueous acidic cupric sulfate electrolytes
Journal article2013, Journal of the Electrochemical Society, (160) 2, p.D60-D65Publication Exploration of process window for fill of sub 30 nm features by direct plating
Meeting abstract2012, 222nd Meeting of the The Electrochemical Society: Symposium E8: Processing Materials of 3D Interconnects, 7/10/2012, p.2733Publication Nanoscale etching: dissolution of III-As and Ge in HCl/H2O2 solutions
Proceedings paper2015-10, Semiconductor Cleaning Science and Technology 14 - SCST 14, 11/10/2015, p.235-242Publication Nucleation and growth of copper on Ru-based substrates: I. the effect of the inorganic components
Meeting abstract2011, 220th ECS Fall Meeting Symposium F4: Semiconductors, Metal Oxides, and Composites, 9/10/2011, p.2329Publication Nucleation and growth of copper on Ru-Based Substrates: I. The effect of the inorganic components
Proceedings paper2012, Processing Materials of 3D Interconnects, Damascene and Electronics Packaging, 9/10/2011, p.75-82Publication Nucleation and growth of copper on Ru-based substrates: II. The effect of the suppressor additive
Proceedings paper2012, Processing Materials of 3D Interconnects, Damascene and Electronics Packaging, 9/10/2011, p.99-110Publication Nucleation and growth of copper on Ru-based substrates: II. the effect of the suppressor additive
Meeting abstract2011, 220th ECS Fall Meeting Symposium F4: Semiconductors, Metal Oxides, and Composites, 9/10/2011, p.2331Publication Physicochemical mechanism of damascene copper plating: effect of suppressor
Meeting abstract2009, 216th ECS Meeting, 4/10/2009, p.2708Publication Polyether suppressors for filling sub 30 nm features by direct plating
Proceedings paper2012, Electrochemistry 2012, 17/09/2012Publication Tailoring copper island density for copper plating on a RuTa substrate
Proceedings paper2010, Electrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire), 24/04/2010, p.9-16Publication The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates
Journal article2013, Electrochimica Acta, 92, p.474-483Publication The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating
Journal article2014, Electrochimica Acta, 127, p.315-326Publication The effect of the substrate characteristics on the electrochemical nucleation and growth of copper
Journal article2016, Journal of the Electrochemical Society, (163) 12, p.D3053-D3061Publication Ultra-low copper baths for sub-30nm copper interconnects
Meeting abstract2011, 220th ECS Fall Meeting Symposium F4: Semiconductors, Metal Oxides and Composites, 9/10/2011, p.2330Publication Ultra-low copper baths for sub-35 nm copper interconnects
Journal article2013, Journal of the Electrochemical Society, (160) 12, p.D3222-D3259