Browsing by Author "Taklo, Maaike"
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Publication 3D integration technology: status and application development
Proceedings paper2010, 40th European Solid-State Device Research Conference - ESSDERC, 13/09/2010, p.9-16Publication Residual stress in silicon caused by Cu-Sn wafer-level packaging
Meeting abstract2013, International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK, 16/07/2013, p.73317