Browsing by Author "Tielemans, Luc"
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Publication Accelerated ageing with in situ electrical testing: a powerful tool for the building-in approach to quality and reliability in electronics
Journal article1994, Quality and Reliability Engineering International, (10) 1, p.15-26Publication DESTIN: A new approach to interconnect reliability testing
Journal article1998, Semiconductor Fabtech, 7, p.343-347Publication The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique
Journal article1999, Microelectronics and Reliability, (39) 11, p.1657-1665