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The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique
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The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique
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Date
1999
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van Olmen, Jan
;
Manca, Jean
;
De Ceuninck, Ward
;
De Schepper, Luc
;
D'Haeger, V.
;
Witvrouw, Ann
;
Maex, Karen
;
Vandevelde, Bart
;
Beyne, Eric
;
Tielemans, Luc
Journal
Microelectronics and Reliability
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1852
since deposited on 2021-10-14
Acq. date: 2025-12-16
Citations
Metrics
Views
1852
since deposited on 2021-10-14
Acq. date: 2025-12-16
Citations