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The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique

Date

1999
Journal article
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dc.contributor.authorVan Olmen, Jan
dc.contributor.authorManca, Jean
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorDe Schepper, Luc
dc.contributor.authorD'Haeger, V.
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorMaex, Karen
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorTielemans, Luc
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T11:48:35Z
dc.date.available2021-10-14T11:48:35Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3940
dc.source.beginpage1657
dc.source.endpage1665
dc.source.issue11
dc.source.journalMicroelectronics and Reliability
dc.source.volume39
dc.title

The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique

dc.typeJournal article
dspace.entity.typePublication
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