Browsing by Author "Tomatsu, Itsuro"
Now showing 1 - 1 of 1
- Results per page
- Sort Options
Publication Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1859-1862