Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking

Publication:

2024

Proceedings Paper

Author(s)

;

;

Negishi, Ryo

;

Tomatsu, Itsuro

;

;

N/A

375 since deposited on 2024-12-07

Acq. date: 2026-02-26