Publication:
Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0003-0550-6273 | |
| cris.virtual.orcid | 0000-0002-3096-050X | |
| cris.virtual.orcid | 0000-0003-2448-9165 | |
| cris.virtual.orcid | 0009-0006-7414-2898 | |
| cris.virtualsource.department | 1f080161-3216-4c75-86ed-d343316d8b4f | |
| cris.virtualsource.department | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.department | e506cc22-f003-4f27-bc24-12771348f7aa | |
| cris.virtualsource.department | 4e0f1aee-fddc-45cc-9f65-8b301438b983 | |
| cris.virtualsource.orcid | 1f080161-3216-4c75-86ed-d343316d8b4f | |
| cris.virtualsource.orcid | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.orcid | e506cc22-f003-4f27-bc24-12771348f7aa | |
| cris.virtualsource.orcid | 4e0f1aee-fddc-45cc-9f65-8b301438b983 | |
| dc.contributor.author | Rip, Jens | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Negishi, Ryo | |
| dc.contributor.author | Tomatsu, Itsuro | |
| dc.contributor.author | Cuypers, Dieter | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Rip, Jens | |
| dc.contributor.imecauthor | Cuypers, Dieter H. | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Derakhshandeh, Jaber | |
| dc.contributor.orcidimec | Rip, Jens::0009-0006-7414-2898 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
| dc.date.accessioned | 2025-02-12T09:07:23Z | |
| dc.date.available | 2024-12-07T16:58:04Z | |
| dc.date.available | 2025-02-12T09:07:23Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00311 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44953 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1859 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 1862 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 4 | |
| dc.title | Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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