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Browsing by Author "Urayama, Daisuke"

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    A novel CBRAM integration using subtractive dry-etching process of Cu enabling high-performance memory scaling down to 10nm node

    Redolfi, Augusto  
    ;
    Goux, Ludovic  
    ;
    Jossart, Nico  
    ;
    Yamashita, Fumiko
    ;
    Nishimura, Eiichi
    Proceedings paper
    2015, IEEE Symposium on VLSI Technology, 15/06/2015, p.134-135

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