Browsing by Author "Van Dooren, Sofie"
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Publication Integration of anodized tantalum capacitors in thin film MCM-D
Publication Parametric compact models for flip chip assemblies
Journal article2000, IEEE Trans. Components and Packaging Technologies, (23) 3, p.555-561Publication Parametric compact models for flip chip assemblies
Proceedings paper1999, 5th International Workshop Thermal Investigations of ICs and Systems - THERMINIC, 3/10/1999, p.312-318Publication Parametric compact models for the 72-pins polymer stud grid array (Tm)
Journal article2001, Microelectronics Journal, (32) 10_11, p.839-846Publication Parametric compact models for the 72-pins Polymer Stud Grid ArrayTM
Proceedings paper2000, Proceedings of the 6th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 24/09/2000, p.205-210Publication The isocurrent test: a promising tool for wafer-level evaluation of the interconnect reliability
Journal article1996, Microelectronics and Reliability, 36, p.1847-1850Publication Transient thermal characterization of the polymer stud grid array(tm)
Journal article2001, IEEE Trans. Components and Packaging Technologies, (24) 4, p.554-558Publication Transient thermal characterization of the Polymer Stud Grid ArrayTM
Proceedings paper2000, Proceedings of the 6th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 24/09/2000, p.225-229