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Articles
Parametric compact models for flip chip assemblies
Publication:
Parametric compact models for flip chip assemblies
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Date
2000
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van Dooren, Sofie
;
Vandevelde, Bart
;
Beyne, Eric
;
Christiaens, Filip
;
Corlatan, D.
Journal
IEEE Trans. Components and Packaging Technologies
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1997
since deposited on 2021-10-14
Acq. date: 2025-12-15
Citations
Metrics
Views
1997
since deposited on 2021-10-14
Acq. date: 2025-12-15
Citations