Publication:

Parametric compact models for flip chip assemblies

Date

2000
Journal article
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dc.contributor.authorVan Dooren, Sofie
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorChristiaens, Filip
dc.contributor.authorCorlatan, D.
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T13:58:35Z
dc.date.available2021-10-14T13:58:35Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4819
dc.source.beginpage555
dc.source.endpage561
dc.source.issue3
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.volume23
dc.title

Parametric compact models for flip chip assemblies

dc.typeJournal article
dspace.entity.typePublication
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