Browsing by Author "Vanhee, Filip"
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Publication Finite element modeling of aolder joint fatigue in four-point bending test
Proceedings paper2012, 13th Int. Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics - EuroSimE, 16/04/2012Publication Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Proceedings paper2016-04, 17th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectr. and Microsyst. - EuroSimE, 17/04/2016Publication Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Journal article2017, Microelectronics Reliability, 74, p.131-135Publication Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board
Proceedings paper2018-04, 19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE, 16/04/2018, p.1-8