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Browsing by Author "Vanlathem, E."

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    An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration

    Gonzalez, Mario  
    ;
    Vandevelde, Bart  
    ;
    Vanden Bulcke, Mathieu  
    ;
    Winters, Christophe  
    ;
    Beyne, Eric  
    Proceedings paper
    2003, Proceedings of the 53rd Electronic Components and Technology Conference, 27/05/2003, p.858-863

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