Browsing by Author "Wang, Liang"
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Publication An approach to produce a stack of photo definable polyimide based flat UTCPs
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
Journal article2012, IEEE Transactions on Components, Packaging and Manufacturing Technology, (2) 7, p.1099-1106Publication High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
Proceedings paper2012, 45th International Symposium on Microelectronics, 9/09/2012, p.940Publication Self-aligned flat ultra-thin chip package for flexible circuits
Journal article2013, Circuit World, (39) 4, p.174-180