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Self-aligned flat ultra-thin chip package for flexible circuits
Publication:
Self-aligned flat ultra-thin chip package for flexible circuits
Date
2013
Journal article
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29057.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wang, Liang
;
Cauwe, Maarten
;
Brebels, Steven
;
De Raedt, Walter
;
Vanfleteren, Jan
Journal
Circuit World
Abstract
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1815
since deposited on 2021-10-21
Acq. date: 2025-10-28
Citations
Metrics
Views
1815
since deposited on 2021-10-21
Acq. date: 2025-10-28
Citations