Publication:

Self-aligned flat ultra-thin chip package for flexible circuits

Date

2013
Journal article
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dc.contributor.authorWang, Liang
dc.contributor.authorCauwe, Maarten
dc.contributor.authorBrebels, Steven
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-21T14:26:31Z
dc.date.available2021-10-21T14:26:31Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.issn0305-6120
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23374
dc.source.beginpage174
dc.source.endpage180
dc.source.issue4
dc.source.journalCircuit World
dc.source.volume39
dc.title

Self-aligned flat ultra-thin chip package for flexible circuits

dc.typeJournal article
dspace.entity.typePublication
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