Browsing by Author "Wang, S."
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Publication Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
Journal article2024, IEEE TRANSACTIONS ON ELECTRON DEVICES, (71) 12, p.7963-7969Publication Buried Power Rail Metal exploration towards the 1 nm Node
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021