Browsing by Author "Wunderle, Bernhard"

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Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer ( HPVC)

Moloudi, Reza
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Gruen, Tobias
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Verleysen, Willem
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Vandevelde, Bart
;
Cleuren, Silke G. C.
Proceedings paper
2023, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 16-19, 2023
Residual stress in silicon caused by Cu-Sn wafer-level packaging

Taklo, Maaike
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Vardĝy, Astrid-Sofie
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De Wolf, Ingrid
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Simons, Veerle
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van de Wiel, H.J.
Meeting abstract
2013, International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK, 16/07/2013, p.73317