Browsing by Author "Xu, Baohui"
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Publication A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis
Journal article2024, IEEE TRANSACTIONS ON ELECTRON DEVICES, (71) 1, p.184-191Publication A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
Journal article2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 9, p.4779-4785Publication Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects
Journal article review2022, MICROMACHINES, (13) 7, p.1148