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A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis
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A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis
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Date
2024
Journal article
https://doi.org/10.1109/TED.2023.3293780
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Xu, Baohui
;
Chen, Rongmei
;
Zhou, Jiuren
;
Liang, Jie
Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
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989
since deposited on 2023-08-21
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Acq. date: 2025-12-11
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Metrics
Views
989
since deposited on 2023-08-21
2
last month
Acq. date: 2025-12-11
Citations