Publication:

A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis

Date

2024
Journal article
https://doi.org/10.1109/TED.2023.3293780
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dc.contributor.authorXu, Baohui
dc.contributor.authorChen, Rongmei
dc.contributor.authorZhou, Jiuren
dc.contributor.authorLiang, Jie
dc.contributor.imecauthorChen, Rongmei
dc.date.accessioned2024-01-08T10:43:46Z
dc.date.available2023-08-21T18:00:46Z
dc.date.available2024-01-08T10:43:46Z
dc.date.issued2024
dc.description.wosFundingText& nbsp;This work was supported in part by the National Natural Science Foundation of China under Grant 62104138.
dc.identifier.doi10.1109/TED.2023.3293780
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42374
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage184
dc.source.endpage191
dc.source.issue1
dc.source.journalIEEE TRANSACTIONS ON ELECTRON DEVICES
dc.source.numberofpages8
dc.source.volume71
dc.subject.keywordsTHROUGH-SILICON
dc.subject.keywordsTEMPERATURE-COEFFICIENT
dc.subject.keywordsPERFORMANCE ANALYSIS
dc.subject.keywordsCARBON
dc.subject.keywordsRESISTANCE
dc.subject.keywordsINTERCONNECTS
dc.subject.keywordsCONDUCTIVITY
dc.subject.keywordsEND
dc.title

A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis

dc.typeJournal article
dspace.entity.typePublication
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