Browsing by Author "Yang, Shoufeng"
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Publication 3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.2383-2390Publication Experimental characterization of a chip level 3D printed microjet liquid impingement cooler for high performance systems
Journal article2019, IEEE Transactions on Components, Packaging and Manufacturing Technology, (9) 9, p.1815-1824Publication Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards
Journal article2022-06, MATERIALS TODAY COMMUNICATIONS, 31, p.103482Publication Preliminary Study on Hybrid Manufacturing of the Electrical-Mechanical Integrated Systems (EMIS) Assisted by the LCD Stereolithography Technology
Proceedings paper2019, 30th Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, 12/08/2019