Publication:
Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards
Loading...
Journal
Abstract
Description
Metrics
Views
1681 since deposited on 2022-05-21
2last month
Acq. date: 2025-12-09
Citations
Metrics
Views
1681 since deposited on 2022-05-21
2last month
Acq. date: 2025-12-09
Citations