Publication:

Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards

Date

2022-06
Journal article
https://doi.org/10.1016/j.mtcomm.2022.103482
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dc.contributor.authorFei, Guanghai
dc.contributor.authorNie, Lei
dc.contributor.authorZhong, Lipeng
dc.contributor.authorShi, Qimin
dc.contributor.authorHu, Kehui
dc.contributor.authorParra-Cabrera, Cesar
dc.contributor.authorOprins, Herman
dc.contributor.authorAmeloot, Rob
dc.contributor.authorYang, Shoufeng
dc.contributor.imecauthorOprins, Herman
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.date.accessioned2022-06-01T08:10:41Z
dc.date.available2022-05-21T02:19:27Z
dc.date.available2022-05-23T06:24:24Z
dc.date.available2022-06-01T08:10:41Z
dc.date.issued2022-06
dc.description.wosFundingTextAcknowledgements Guanghai Fei warmly acknowledges the scholarship provided by China Scholarship Council, China (CSC: 201708430113) . Furthermore, the authors acknowledge the support with respect to some experimental help from the technicians at the KU Leuven divisions MTM and PMA.
dc.identifier.doi10.1016/j.mtcomm.2022.103482
dc.identifier.issn2352-4928
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39862
dc.publisherELSEVIER
dc.source.beginpage103482
dc.source.issuena
dc.source.journalMATERIALS TODAY COMMUNICATIONS
dc.source.numberofpages11
dc.source.volume31
dc.subject.keywordsPOLYMER MATRIX COMPOSITES
dc.subject.keywordsEPOXY-RESINS
dc.subject.keywordsSUSPENSIONS
dc.subject.keywordsDEVICES
dc.subject.keywordsBEHAVIOR
dc.subject.keywordsFLOW
dc.subject.keywordsSIZE
dc.subject.keywordsPolymer-matrix composites (PMCs); Thermal properties; Surface analysis; Stereolithography 3D printing
dc.title

Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards

dc.typeJournal article
dspace.entity.typePublication
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