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Browsing by Author "Yang, Z."

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    Publication

    Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications

    Wei, Tiwei  
    ;
    Oprins, Herman  
    ;
    Cherman, Vladimir  
    ;
    Yang, Z.
    ;
    Rivera, K.
    ;
    Van der Plas, Geert  
    Proceedings paper
    2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.1422-1429

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