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Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
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Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
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Date
2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00225
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wei, Tiwei
;
Oprins, Herman
;
Cherman, Vladimir
;
Yang, Z.
;
Rivera, K.
;
Van der Plas, Geert
;
Pawlak, Bartek
;
England, L.
;
Beyne, Eric
;
Baelmans, M.
Journal
na
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1815
since deposited on 2021-11-02
Acq. date: 2025-12-13
Citations
Metrics
Views
1815
since deposited on 2021-11-02
Acq. date: 2025-12-13
Citations