Publication:

Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications

Date

Loading...
Thumbnail Image

Abstract

Description

Metrics

Views

1815 since deposited on 2021-11-02
Acq. date: 2025-12-13

Citations

Metrics

Views

1815 since deposited on 2021-11-02
Acq. date: 2025-12-13

Citations