Publication:
Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
| dc.contributor.author | Wei, Tiwei | |
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Yang, Z. | |
| dc.contributor.author | Rivera, K. | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Pawlak, Bartek | |
| dc.contributor.author | England, L. | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Baelmans, M. | |
| dc.contributor.imecauthor | Wei, T-W | |
| dc.contributor.imecauthor | Oprins, H. | |
| dc.contributor.imecauthor | Cherman, V | |
| dc.contributor.imecauthor | Van der Plas, G. | |
| dc.contributor.imecauthor | Pawlak, B. J. | |
| dc.contributor.imecauthor | Beyne, E. | |
| dc.contributor.imecauthor | Wei, Tiwei | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Pawlak, Bartek | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, E.::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2022-01-25T11:47:29Z | |
| dc.date.available | 2021-11-02T16:04:36Z | |
| dc.date.available | 2022-01-25T11:47:29Z | |
| dc.date.issued | 2020 | |
| dc.identifier.doi | 10.1109/ECTC32862.2020.00225 | |
| dc.identifier.eisbn | 978-1-7281-6180-8 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38154 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1422 | |
| dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 03-30, 2020 | |
| dc.source.conferencelocation | Virtual | |
| dc.source.endpage | 1429 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 8 | |
| dc.title | Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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