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Browsing by Author "Yoon, A."

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    Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

    Kirimura, Tomoyuki
    ;
    Croes, Kristof  
    ;
    Siew, Yong Kong  
    ;
    Vanstreels, Kris  
    ;
    Czarnecki, Piotr  
    Proceedings paper
    2013, IEEE International Interconnect Technology Conference - IITC, 13/06/2013, p.303

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