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Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion
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1925 since deposited on 2021-10-21
2last month
Acq. date: 2025-12-14
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Metrics
Views
1925 since deposited on 2021-10-21
2last month
Acq. date: 2025-12-14
Citations