Publication:

Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

Date

2013
Proceedings Paper
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dc.contributor.authorKirimura, Tomoyuki
dc.contributor.authorCroes, Kristof
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorVanstreels, Kris
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorDictus, Dries
dc.contributor.authorYoon, A.
dc.contributor.authorKolics, A.
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.date.accessioned2021-10-21T08:53:04Z
dc.date.available2021-10-21T08:53:04Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22605
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615555&contentType=Conference+Publications
dc.source.beginpage303
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate13/06/2013
dc.source.conferencelocationKyoto Japan
dc.title

Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

dc.typeProceedings paper
dspace.entity.typePublication
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