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Browsing by Author "Yoshida, Shinji"

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    Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)

    Zhao, Ming  
    ;
    Verbinnen, Greet  
    ;
    Yoshida, Shinji
    ;
    Hayakawa, Susumu
    ;
    Tabuchi, Tomotaka
    Proceedings paper
    2010, 7th Annual International Wafer-Level Packaging Conference, 11/10/2010, p.49-54

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